250mm Green Silicon Carbide Bench Grinding Wheels Glass Semiconductors Polishing

High Quality Ceramic Sintered Green Silicon Carbide Grinding Wheel

For Glass,Ceramic And Semiconductors Polishing Etc.

Model Type: TYC-GW-022

Main Features Of Our Silicon Carbide Grinding Wheel:

• The time of trimming is short.

• The parallelism of cutting edge dressing can reach 0.02mm.

• The sharpness of grinding plate is good after cutting edge dressing.

•  After cutting edge dressing, the number of grinding workpieces is large and the dressing times are reduced.

• Long service life;

• Good self sharpening;

• High cutting efficiency;

Process Flow:

First, the green silicon carbide material is pressed and bonded by a mold with a binder, and then the grinding wheel is fired at high temperature. In general grinding, compared with other grinding wheels, the advantages are not particularly obvious. However, if we process some special workpieces according to the characteristics of the materials, we can achieve better results.

Scope of application:

Suitable to grinding and polish various of Cemented carbide, glass, ceramics, semiconductor materials, etc

 Sketch  map of our CBN abrasive wheel

    D: out diameter

    H: inner diameter

    T:  thicknesss

    X:  abrasive area width

Specificaion of Our Graphite Grinding Wheel:

• to be customized according to client's requirement.

More Pictures of our Green Silicon Carbide Grinding Wheel :

Precautions for use:

• Please check carefully before installing the cutting wheel. If there is any gap or other damage, please stop using it.

• When the cutting wheel is marked with the rotation direction, it should be consistent with the rotation direction of the machine tool. On the contrary, the cutting is not sharp, and it is difficult to give full play to the performance of the cutting wheel.

• Please do not use the cutting wheel that does not meet the requirements.

• If any abnormality is found in the cutting process, stop the machine immediately and check the cause.

• When the cutting is not sharp, the grinding wheel should be trimmed. If it is used continuously, the grinding wheel may be damaged due to overheating and overload.

• When the grinding wheel rotates, it is strictly forbidden to cut by hand, let alone touch the sand by hand and body

• The cutting wheel is forbidden to be used in operations other than grooving or cutting, so as to avoid abnormal operation due to uneven stress.

Ordering instructions:

When you order for the first time, please provide the following parameters, so that we can help you choose the most suitable cutting wheel.

Specification and size: abrasive, particle size, binder, outer diameter, thickness, inner diameter, abrasive working layer width, substrate thickness, etc. purpose: workpiece name, cutting size, cutting material;

Service conditions of grooving and cutting: machine tool, grinding wheel speed, feed speed and cutting depth;

Dry and wet cutting requirements: cutting accuracy, chipping requirements, processing surface integrity, etc

Special requirements: whether the tool is assembled and used, whether the resin cutting wheel needs to conduct electricity, whether the outer circle of the cutting wheel has a water tank, the size and quantity of the water tank, whether there is a chip removal groove on the outer side of the cutting wheel base, etc.

Order Operating Procedure: